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JIEP Advanced Electronics Packaging (Jisso) Technology Symposium
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PROTEC Seminar
Open Seminar
Academic Facilities & Laboratories Poster Program
Electronic Circuits Plaza
The 4th JPCA Award
Electronics Handicraft Class
Educational event
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Exhibitor's LIST
(in Alphabetical order)
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2008 Electronic Circuits Products Category
2008 Electronic Circuits Process Products Category
2008 DES(Design and manufacturing Engineering Solution) Expo Products Category
2008 MicroTEST Products Category
2008 Microelectronics Show
JISSO PROTEC 2008
The 3rd eco-Pavilion
The 2nd Advance Electronics Pavilion
The 2nd Science and Core Technologys　Pavilion
Catalog Exhibition
search of
each Main
Handling
Products
Please select the product
EC001 Rigid-type PWBs(Single/Double/Multilayer)
EC002 Build-Up MLBs
EC003 Flexible Electronic Circuits Boards
EC004 Flex-Rigid Circuits Boards
EC005 Ceramic PWBs
EC006 Metal Core Printed Boards
EC007 Rigid Module Boards
EC008 TAB/COF
EC009 Ceramic Module Boards
EC010 Other Electronic Circuits Boards
EC011 Base Materials for Rigid Type Boards
EC012 Film/Tape Materials
EC013 Sectional Process(es) ofElectronic Circuit Board Manufacturing
Please select the product
CP001 Through-hole Mounting Electronic Circuit Jisso Boards
CP002 Chip Component Electronic Circuit Jisso Boards
CP003 IC-Packaging Electronic Circuit Jisso Boards
CP004 Wire Bonding Electronic Circuit Jisso Boards
CP005 TAB/COF Electronic Circuit Jisso Boards
CP006 Flip Chip Mounting Electronic Circuit Jisso Boars
CP007 Other Electronic Circuit Jisso Board
Please select the product
EP001 Equipment & Materials for Artwork Generation/Photo Tooling for Manufacturing Rigid PWB
EP002 Equipment & Materials for Mechanical Processes for Manufacturing Rigid PWB
EP003 Equipment & Materials for Laminating Processes for Manufacturing Rigid PWB
EP004 Equipment & Materials for Surface Finishing/Cleaning/Treatment Processes for Manufacturing Rigid PWB
EP005 Equipment & Materials for Plating Processes (Panel/Pattern/Contact Plating etc.) for Manufacturing Rigid PWB
EP006 Equipment & Materials for Imaging Processes for Manufacturing Rigid PWB
EP007 Equipment & Materials for Etching Processes and Resist Removal Processes of Manufacturing Rigid PWB
EP008 Equipment & Materials for Solder Application and Finishing Processes for Manufacturing Rigid PWB
EP009 Miscellaneous Equipment and Materials for Manufacturing Rigid PWB (Tool Fabrication, etc.)
EP010 Equipment for Manufacturing Rigid PWBs
EP011 Environmental Control and Recycle Equipment and Maintenance Facilities for Rigid Electronic Circuit Board
Please select the product
D001 Application Software
D002 Electronic Circuit Board Design
D003 Electronics Packaging Design
D004 System Consultation Service
D005 EMS/ODM Services
D006 Communication Network Solution for Network/Internet/Multimedia
D007 CAE Tools (CAD/CAM/CIM)
D008 Product/Goods Design Technology
D009 Case Design
D010 Model Development System for Trial Manufacture
D011 Molding/Forming Equipment
D012 Rapid Prototyping Support Equipment/Support System
Please select the product
T001 AutomaticOpticalInspectionEquipment
T002 X-ray Inspection Equipment
T003 Evaluation Systems
T004 Tester
T005 Special Tools for Testing and Measuring/Inspection System
T006 2D/3D Measuring Equipment
T007 Measuring Instruments
T008 Analyzers
T009 Test/Inspection Business
T010 Sensing Imaging Technology Systems
T011 Virtual Reality technology
Please select the product
J001 Products with High-density/High-frequency electronics packaging technologies
J002 High-density Substrates/Interposers/LSI Packages (incl. SiP)
J003 Electronic Components
J004 Embedded Packaging Board
J005 Wafer Process (incl. Process Equipment and Materials)
J006 Display Device/Optical Device
J007 Thick Film and Thin Film Materials (incl. Paste Materials)
J008 MaterialsrelatedtoElectronicsPackaging(Incl.Solders/Lead-freeSolder/AnisotropicConductive/etc.)
J009 High Frequency Equipment/Parts/Materials
J010 Environmental Friendly Equipments/Materials for Electronics Packaging Process
Please select the product
E002 Green Process Materials
E003 Environmental Friendly Machines for Manufacturing Electronic Boards
E004 Environmental Friendly Materials no Electronic Packaging
E006 Environmental Friendly Electronic Boards
E007 Environmental Friendly Electronic Devices
E008 Environmental Friendly Machines
E009 Eco-Processing System
E010 Recycle System
E011 Environmental related Testing and Analyzing
E012 Consulting Services for Ecology
E013 Other Services for Environmental Friendly Technologies
E005 Environmental Friendly Machines on Electronic Packaging
E001 Environmental Friendly Base Materials
Please select the product
AP001 Car Electronics
AP002 Manufacturing System for Car Electronics
AP003 Parts/Materials for Car Electronics
AP004 Manufacturing Machines for Car Electronics
AP005 Flat Panel Display
AP006 Manufacturing System for Flat Panel Display
AP007 Parts/Materials for Flat Panel Display
AP008 Manufacturing Machines for Flat Panel Display
AP009 Mobile Hardware
AP010 Manufacturing System for Mobile Hardware
AP011 Parts/Materials for Mobile Hardware
AP012 Manufacturing Equipment for Mobile Hardware
AP013 Others Related Services for Advanced Electronics
Please select the product
SP001 Materials for Optical Technologies
SP002 Optical Device and Module
SP003 Opt-electronic Circuits Products
SP004 Optical Equipment and Instrument
SP005 Industry-concerned system
SP006 Nanotech Materials
SP007 Nanotech Electronics
SP008 MEMS
SP009 Micro Processing/Micro Patterning Technology
SP010 Other Related Services for Related Services for Science and Core Technologies
Please select the product
EJ001 Electronics Assembly/Mounting Equipment
EJ002 Cream Solder Printing Equipment
EJ003 Soldering Equipment
EJ004 Dispensers
EJ005 Transporting System
EJ006 Taping Machines/Materials
EJ007 Bulk Feeders
EJ008 Automatic Assembly Equipment
EJ009 Other Feeders
EJ010 Device Packing Materials (Taping Reel/Carrier Tape/TAB Tape and Reel/Magazine Stick/LSI Tray/Bulk Case/Others)
EJ011 AOI Systems for Electronics Assembly and Electronics Packaging (Jisso) Process
EJ012 Other Equipment and Systems for Electronics Assembly Technologies
Please select the product
SJ001 Wire Bonders
SJ002 Die Bonders
SJ003 Flip Chip Packaging System
SJ004 LCD/DOG Bonding System
SJ005 BGA/CSP Assembly System
SJ006 TAB Packaging System
SJ007 OLB/ILB System
SJ008 COB System
SJ009 Packaging Fabrication-related Materials (incl. Liquid Sealants,Under-fillers,Die Bond, Lead Frames)
Please select the product
SE001 Other Services for Electronic Circuits and Electronics Packaging
Please select the product
PU001 Publications/Magazines
Please select the product

